| 摘要 |
A thin film resistor ( 5 ) of an integrated circuit comprises an elongate resistive film ( 7 ) extending between electrical contact pads ( 10,11 ). A low impedance element ( 20 ) overlays and is electrically coupled to a portion of the resistive film ( 7 ) in an intermediate portion ( 22 ) thereof adjacent a second side edge ( 17 ) of the resistive film ( 7 ) for conducting current in parallel with the intermediate portion ( 22 ), and for reducing current density in the intermediate portion ( 22 ). First and second transverse edges ( 28,29 ) formed by spaced apart first and second slots ( 26,27 ) which extend from a first side edge ( 16 ) into the resistive film ( 7 ) define with a first side edge ( 16 ) of the resistive film ( 7 ) and the low impedance element ( 20 ) first and second trimmable areas ( 30,31 ) in the intermediate portion ( 22 ). Coarse trimming of the thin film resistor ( 5 ) is carried out by progressively extending a first trimming slot ( 34 ) into the first trimmable area ( 30 ) from the first transverse edge ( 28 ), and fine trimming is carried out by extending a second trimming slot ( 35 ) into the second trimmable area ( 31 ) from the second transverse edge ( 29 ).
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