| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board which does not cause a defect of a lid plating layer and is excellent in crack resistance in conditions of heat cycle etc. SOLUTION: The multilayer printed wiring board has a structure in which a conductor circuit is formed on a substrate via the interlayer resin insulation layer, a through hole is provided on the substrate and a filler is filled in the through hole. In this multilayer printed wiring board, a roughening layer is provided on the inner wall of the through hole, a conductor layer for covering an exposed surface of the through hole of a filler is provided immediately above the through hole, a roughening layer is formed on the entire surface including a side surface on the conductor layer and a conductor circuit positioned on the same layer as the conductor layer, and an interlayer resin insulation layer filling the recess portion between the conductors and having a flat surface is formed on the surface of the roughening layer. COPYRIGHT: (C)2007,JPO&INPIT |
