发明名称 |
Complex CMP process and fabricating methods of STI structure and interconnect structure |
摘要 |
A complex CMP process is described. A target film is coarsely polished using a first polishing platen in a first CMP machine. The remaining target film is then fine polished using successively a second polishing platen and a third polishing platen in a second CMP machine that is different from the first CMP machine.
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申请公布号 |
US2007062910(A1) |
申请公布日期 |
2007.03.22 |
申请号 |
US20050233585 |
申请日期 |
2005.09.22 |
申请人 |
YEH MING-HSIN;LEE CHENG-CHUAN;CHEN MING-TE;WU YI-CHING;HSIAO CHIN-HSIANG |
发明人 |
YEH MING-HSIN;LEE CHENG-CHUAN;CHEN MING-TE;WU YI-CHING;HSIAO CHIN-HSIANG |
分类号 |
C03C15/00;B44C1/22;C23F1/00;H01L21/302;H01L21/461 |
主分类号 |
C03C15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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