| 摘要 |
A method for forming an opening on a material layer is provided. First, a dielectric layer is formed on the material layer. Then, a metallic hard mask layer and a cap layer are sequentially formed on the dielectric layer. Thereafter, a patterned photoresist layer is formed on the cap layer. The patterned photoresist layer exposes a portion of the surface of the cap layer. After that, a first etching operation is carried out using the patterned photoresist layer as a mask to remove a portion of the cap layer and the metallic hard mask layer until the surface of the dielectric layer is exposed. Then, the photoresist layer is removed. A second etching operation is carried out using the cap layer and the metallic hard mask layer as a mask to remove a portion of the dielectric layer and form an opening.
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