Semiconductor component functional unit and production process has rows and columns of chips on a connection plate and a multi-layer wiring structure insulated by a hybrid organic-inorganic polymer dielectric

摘要

A functional unit comprises rows and columns of semiconductor chips (3) on a connection plate with at least one chip at each position having an active upper side (8) and rear (10) and edge (12,14) sides. The active side and connection plate are coplanar and the rear and edge sides are embedded in a housing of plastic mass (4). A single or multi-layer wiring structure of conductive leads (17,18) on the plate has dielectric layers (16) to mutually insulate the leads and the dielectric comprises and organic/inorganic hybrid polymer. An independent claim is also included for the following: (A) a semiconductor component as above; and (B) a production process for the above.