| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique for increasing a connection reliability between a bonding pad and a ball in primary bonding, and a connection reliability between a lead and a wire in secondary bonding. <P>SOLUTION: A semiconductor chip 15 is positioned on a tab 14, and an inner lead 13 is formed around the tab 14. The tip end 13a (closer to the tab 14) of the inner lead 13 is tapered. A bonding pad 16 formed on the semiconductor chip 15 is connected to the inner lead 13 through a ball 17 and a wire 18. The inner lead 13 and the wire 18 are compressed at the tapered part of the inner lead 13. The taper angle of the tapered part of the inner lead 13 is set to be in a range, for example, not smaller than 3° and not larger than 15°. <P>COPYRIGHT: (C)2007,JPO&INPIT |
