| 摘要 |
A method of forming circuit patterns on a printed circuit board is disclosed. The method of forming circuit patterns on a printed circuit board comprising: (a) applying etchant on portions of an insulation substrate where the circuit patterns are to be formed, (b) curing the etchant by adjusting curing conditions, (c) applying metal ink on the etched circuit patterns, and (d) sintering the metal ink, allows a great reduction in production costs, since the processes of applying photoresist (PR), exposing, and developing can be eliminated to simplify the overall process, and the circuit patterns of printed circuit boards can be formed minutely and with precision with a fewer number of processes and less time.
|
