Attachment tape strip and chip scale type semiconductor package using the same,申请号KR19990034094-传众专利搜索

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发明名称	Attachment tape strip and chip scale type semiconductor package using the same
摘要
申请公布号	KR100697623(B1)	申请公布日期	2007.03.22
申请号	KR19990034094	申请日期	1999.08.18
申请人		发明人
分类号	H01L23/50	主分类号	H01L23/50
代理机构		代理人
主权项
地址

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