| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulation of optical semiconductor free from deterioration in ultraviolet radiation and excellent in moisture resistance. SOLUTION: The epoxy resin composition for encapsulation of optical semiconductor comprises (A) an epoxy resin obtained by cohydrolysis and condensation of an alkoxysilane compound having an epoxy group, (B) a hydrogenated epoxy resin obtained by hydrogenating an aromatic ring of an epoxy resin expressed by general formula (3), (C) a hardener, and (D) a hardening accelerator. COPYRIGHT: (C)2007,JPO&INPIT
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