发明名称 LASER ANNEALING METHOD AND DEVICE
摘要 A laser annealing method which is carried out by irradiating with a laser beam a semiconductor film formed on the surface of a substrate, and which comprises the step of generating a linearly polarized rectangular laser beam having a rectangular section perpendicular to an advancing direction with its electric field directed toward the long-side direction of the rectangle, or an elliptically polarized rectangular laser beam with its major axis directed toward the long-side direction, the step of allowing the rectangular laser beam to enter the surface of the substrate, and the step of setting the wavelength of the rectangular laser beam to a length which is about the desired size of a crystal grain in a stationary wave direction.
申请公布号 WO2007032322(A1) 申请公布日期 2007.03.22
申请号 WO2006JP318006 申请日期 2006.09.12
申请人 ISHIKAWAJIMA-HARIMA HEAVY INDUSTRIES CO., LTD.;KAWAKAMI, RYUSUKE;NISHIDA, KENICHIRO;KAWAGUCHI, NORIHITO;MASAKI, MIYUKI;YOSHINOUCHI, ATSUSHI 发明人 KAWAKAMI, RYUSUKE;NISHIDA, KENICHIRO;KAWAGUCHI, NORIHITO;MASAKI, MIYUKI;YOSHINOUCHI, ATSUSHI
分类号 H01L21/268;H01L21/20;H01L21/336;H01L29/786 主分类号 H01L21/268
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