发明名称 APPARATUS FOR REMOVING PLATED LAYER OF TWO-PIECE WHEEL
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for removing a plated layer of a two-piece wheel, which can remove the plated layer on the portion to be welded of the inside peripheral surface of a rim, and can obtain the two-piece wheel having a plated rim without requiring the complicated work. SOLUTION: The apparatus for removing the plated layer on the portion RW to be welded of the inside peripheral surface of the two-piece wheel composed of the rim 2 and a disk comprises a pair of supporting rollers 13 which are horizontally arranged, a positioning member 15 for positioning the rim 2 in the axial direction of the supporting rollers 13, a pair of holding rollers 19 for holding the rim 2 between the supporting rollers 13 and the holding rollers 19, a rotationally driving means for rotationally driving the held rim 2, and a polishing means for removing the plated layer on the portion RW to be welded by extending toward the inside of the rim 2 and by polishing the portion RW in the rim 2 to be welded with the disk. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007069340(A) 申请公布日期 2007.03.22
申请号 JP20060155686 申请日期 2006.06.05
申请人 WORK:KK 发明人 TANAKA TAKESHI
分类号 B24B21/02;B24B5/18;B60B3/00 主分类号 B24B21/02
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