| 摘要 |
PROBLEM TO BE SOLVED: To provide a double-sided wiring board and method of manufacturing it adapted well for both the solder flowing construction method and the solder reflowing construction method, as well as capable of improving the curvature of a substrate in soldering quality and a soldering process etc., in addition to the improvement in current load capacity. SOLUTION: Electric conductive patterns 3a-3d and 4a-4d of both sides of an insulated board 2 are electrically connected through a via 5. On the electric conductive patterns 3a-3c in a surface 2a, two or more solder bumps 20-22 are formed so that their outline may be made nearly in the rectangular shape, and their long sides may be matched with current directions A, B and C. On the electric conductive patterns 4a-4d of a rear surface 2b, there are provided two or more solder bumps 23 formed nearly in the shape of a circle in the outline. COPYRIGHT: (C)2007,JPO&INPIT
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