| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhering method of solder powder for a fine circuit pattern, a manufacturing method of an electronic circuit board with solder, an electronic circuit board, and a reuse method of a solder powder, in a manufacturing method of the electronic circuit board, wherein adhesiveness is given to the surface of an exposed metal surface of the electronic circuit board, and solder powder is made to adhere to the adhesion portion forming a solder circuit. SOLUTION: The manufacturing method of the solder circuit board and the electronic circuit board with solder, its manufacturing method, and the adhering method of solder powder to reuse the removed excessive solder powder, are provided. Adhesiveness is given to the exposed metal surface of the electronic circuit board by processing with a compound with applied adhesiveness, the solder powder is adhered to the adherent portion by supplying a solder powder slurry suspended in a liquid of water to which deoxidized water or anticorrosive is added, and the excessively adhered solder powder is removed by immersing the electronic circuit substrate in a liquid or by spraying if required. COPYRIGHT: (C)2007,JPO&INPIT |
