| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board which is suitable for mounting a semiconductor device etc. generating heat much like a power element, which is more excellent in radiation property than a conventional technique, and where wiring layer is easily formed to be flat to improve reliability of a soldered part. SOLUTION: The circuit board 10 is provided with wiring layers 12 on a board 11 through insulating layers 13. The board 11 is formed of insulating resin and provided with a cooling medium path 14, and coolers 16 made of aluminum-based metal are buried so as to constitute a part of the cooling medium path 14. The coolers 16 are provided with a plurality of cooling medium channels 16a extending in parallel to channels 14c, and flat parts 16b are formed at places corresponding to the wiring layers 12. For the insulating resin constituting the board 11, resin whose coefficient of thermal expansion is smaller than that of the cooling parts 16. The wiring layers 12 are provided at a plurality of places on the flat parts 16b of the respective cooling parts 16. COPYRIGHT: (C)2007,JPO&INPIT
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