| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive, a pressure-sensitive adhesive sheet using it, and a method for making an electronic component using the pressure-sensitive adhesive sheet. SOLUTION: The pressure-sensitive adhesive comprises a (meth)acrylate oligomer having two or more vinyl groups, a reactive diluent monomer, a photopolymerization initiator, and a chain transfer agent. The pressure sensitive adhesive sheet is obtained by using the adhesive, and the method for making an electronic component comprises using the adhesive sheet. The adhesive sheet can grind an electronic component assembly flat, which assembly has a bump such as a circuit surface with large unevenness and a solder ball, so that the sheet is suitably used for the back grinding of the electronic component assembly commonly called a work piece. COPYRIGHT: (C)2007,JPO&INPIT
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