发明名称 |
LED package |
摘要 |
A package allowing agile deployment of the location of each LED chip includes a heat slug to secure multiple LED chips, two lead frames, a conducting area extending along the edge of the heat slug, and a non-conductive material that connects the heat slug and the lead frame for those multiple LED chips to connect to the conducting area by means of a gold wire without being subject to the presence of the lead frame.
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申请公布号 |
US2007063213(A1) |
申请公布日期 |
2007.03.22 |
申请号 |
US20050230574 |
申请日期 |
2005.09.21 |
申请人 |
LIGHTHOUSE TECHNOLOGY CO., LTD. |
发明人 |
HSIEH HSIANG-CHENG;HUANG TENG-HUEI;SU WEN-LUNG |
分类号 |
H01L33/50;H01L33/58;H01L33/62;H01L33/64 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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