Method of manufacturing chemical mechanical polishing pad

摘要

The present invention relates to a method of manufacturing a chemical mechanical polishing pad which provides a chemical mechanical polishing pad which fully suppresses the occurrence of a scratch on the polished surface and has an excellent polishing rate. The method comprising either one of a group of steps
(A) and a group of steps (B), the group of steps (A) including (A1) the step of preparing a composition for forming a chemical mechanical polishing pad;
(A2) the step of molding the composition for forming a chemical mechanical polishing pad into a pad-like form; (A3) the sep of mounting the pad-like form on the round table of a cutting machine having at least a milling unit equipped with a milling cutter, a drive unit capable of angle indexing and positioning and a round table journaled by the drive unit; (A4) the step of forming the second group of grooves with the milling cutter; and
(A5) the step of forming the first group of grooves, and the group of steps (B) including
(B1) the step of preparing a composition for forming a chemical mechanical polishing pad;
(B2) the step of molding the composition for forming a chemical mechanical polishing pad into a pad-like form having the second group of grooves by using a metal mold having projections corresponding to the shapes of the second group of grooves; and
(B3) the step of forming the first group of grooves.