| 摘要 |
<p>A multi-stacking package and a method for manufacturing the same are provided to suppress effectively separation of conductive balls of an upper package from a substrate of a lower package by binding physically and electrically two packages. A plurality of first conductive balls(126) are formed at a lower part of a first package(120). A second package(140) is used for supporting the first package. The second package is electrically connected with the first package and includes at least one joint hole. A coupling member(160) is connected with the first conductive balls to improve binding force between the first and the second conductive packages. The coupling member is protruded from the first package through the joint hole to a lower part of the second package.</p> |
