Semiconductor device, method for manufacturing the same, circuit substrate and electronic device

摘要

The invention provides highly reliable semiconductor devices, methods for manufacturing the same, circuit substrates and electronic devices. A semiconductor substrate is provided that includes: an integrated circuit and a pad defining a through hole electrically connected to the integrated circuit. A convex section is formed at a first surface where the pad is formed in a region that overlaps the through hole in the semiconductor substrate. A dielectric layer is formed on an inner surface of the convex section. An electrical connection section is provided having a conductive section disposed inside the dielectric layer and a wiring section disposed on the first surface to be electrically connected to the conductive section. An end surface of the conductive section is exposed through a second surface of the semiconductor substrate on the opposite side of the first surface.