| 摘要 |
Provided is an epoxy resin composition for packaging a semiconductor device which is reduced in generation of crack on a pad and a chip in case of the soldering at a high temperature and is decreased in the adhesion between an epoxy encapsulating agent and a wafer chip. The epoxy resin composition comprises a diglycidyl ether bisphenol modified epoxy resin represented by the formula 1; a polyaromatic epoxy resin represented by the formula 3; a polyaromatic curing agent represented by the formula 4; a coupling agent represented by Si(X3)-(CH2)3-O-CH2-R which is pretreated with a glycol or distilled water; a curing accelerator; and an inorganic filler, wherein R is H or a methyl group; G is a glycidyl group; n is an integer of 1-3 in the formula 1; R1 and R2 are identical or different from each other and are a C1-C4 alkyl group; a is an integer of 1-4; and n is an integer of 1-7 in the formula 3 or 4.
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