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发明名称
无电解钯镀覆液
摘要
本发明提供一种无电解钯镀覆液,其镀覆浴之稳定性高且能制得耐蚀性、焊接接合(solder bonding)性、焊线接合(wire bonding)性优异的被覆膜该无电解钯镀覆液之特征为:含有水溶性钯化合物,及作为错合剂之氨、胺化合物、胺基羧酸化合物、羧酸中之任一种,以及作为稳定剂之铋或铋化合物。较佳为再含有作为还原剂之次磷酸、亚磷酸、甲酸、醋酸、、氢硼化合物、胺硼烷化合物、以及此等的盐中之任一种。
申请公布号
TW200710281
申请公布日期
2007.03.16
申请号
TW095126322
申请日期
2006.07.19
申请人
日金属股份有限公司
发明人
相场玲宏;高桥佑史
分类号
C25D11/34(2006.01);C25D11/38(2006.01)
主分类号
C25D11/34(2006.01)
代理机构
代理人
洪武雄;陈昭诚
主权项
地址
日本
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