| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold release film having the processability corresponding to a UV laser and easy to recycle, and a manufacturing method of an electronic material substrate. SOLUTION: In the manufacturing method of the electronic material substrate, the mold release film comprising a laminated film comprising at least two layers is used to be bonded to the electronic material substrate through a pressure-sensitive adhesive layer and, after the electronic material substrate or the inside of it is subjected to wire drawing/perforation processing along with the mold release film from the side of a base material by a laser, the wire drawing/perforation processing is performed by peeling only the surface film of the mold release film to leave the adhesive side film. COPYRIGHT: (C)2007,JPO&INPIT
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