CATALYST ATTACHMENT-ENHANCING AGENT

摘要

Disclosed is a technique for direct plating which causes no precipitation of a metal on the jig coating. A catalyst attachment-enhancing agent comprising a polymeric compound having primary, secondary and tertiary amino groups as an active ingredient; and a method for direct electroplating onto a Pd/Sn colloid catalyst which has been subjected to a conductive treatment, the method comprising the step of, prior to the attachment of the Pd/Sn colloid catalyst to a non-conductive material, treating the non-conductive material with a catalyst attachment-enhancing agent which comprises a polymeric compound having primary, secondary and tertiary amino groups as an active ingredient.