CIRCUIT SUBSTRATE, CIRCUIT ARRANGEMENT, AND FLEXIBLE BOARD

摘要

PROBLEM TO BE SOLVED: To provide a circuit substrate and circuit arrangement that can improve thermal conductivity of the circuit substrate and can easily and surely control a fill amount of a filler. SOLUTION: A circuit substrate 10 has a wiring layer 20 composed of a copper foil, and an insulating substrate 30 formed on the wiring layer 20. The insulating substrate 30 includes an insulating resin film 32 and a filler 34. A plurality of holes 33 are formed in the insulating resin film 32 in its thickness direction such that they are arranged in an orderly manner. The plurality of holes 33 go right through the insulating resin film 32. The holes 33 are filled with the filler 34 that has a thermal conductivity higher than that of the insulating resin film 32 and is insulating. COPYRIGHT: (C)2007,JPO&INPIT