| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED module which can simplify a process of sealing an LED, has high luminous efficiency and is easily bonded to a light guide plate. <P>SOLUTION: This LED module 1 is provided with a substrate 2 having a recess 4 on its surface, a blue LED chip 10 mounted in the recess, a red and/or green LED chips 14 and 16 mounted on a portion other than the recess on the surface, a sealing resin layer 12 including a yellow phosphor filled in the recess, and a transparent sealing resin layer 18 arranged so as to cover the surface other than the recess of the substrate and the yellow phosphor. <P>COPYRIGHT: (C)2007,JPO&INPIT |
