| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a film-like interconnect line tape which is low in restoration stress in the state of bent, and can be stuck to a semiconductor member such as a chip or the like even at relatively low temperature. <P>SOLUTION: The film-like interconnect line tape is constituted by an interconnect line pattern layer, adhesives layer, and insulating film locating between the above 2 layers. The above-mentioned adhesives layer locates at an outer-most layer of the above-mentioned film-like interconnect line tape, its Tg is 120°C or less, and even in the inflexible state, the tape can be suitably stuck to the semiconductor member such as a semiconductor chip or the like in the state of plane by utilizing a property capable of sticking at low temperature. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
