| 摘要 |
PROBLEM TO BE SOLVED: To provide a module type semiconductor element capable of being prevented from being opened during breakage, and using while being connected in multiple series. SOLUTION: One or more pressure-contact semiconductor chips 12 are provided in parallel with a plurality of semiconductor chips 4 provided inside a module. The pressure-contact semiconductor chip 12 and one electrode 7 in two internal main electrodes are connected with a pressure-contact electrode 14. COPYRIGHT: (C)2007,JPO&INPIT |
