| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor chip for generating a controllable frequency, in which obstructive thermal binding between a chip region having a heat source and a chip region of a voltage-controlled oscillating circuit is minimized. <P>SOLUTION: At least part of a contact between a first chip region and a second chip region is positioned so as to function as a heat shield between the first chip region and the second chip region. <P>COPYRIGHT: (C)2007,JPO&INPIT |
