| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a ceramic substrate on which a chip-type electronic part is mounted capable of definitely mounting the chip-type electronic part on the ceramic substrate, and realizing a high-density mounting without using bonding materials such as solder and conductive adhesive; and to provide a method for manufacturing the same. <P>SOLUTION: For the chip-mounted type substrate 10, the chip-type electronic part 12 comprising a ceramic sintered body as an element assembly and having external terminal electrodes 12D, 12E is mounted on the outermost surface of the ceramic substrate 11 having a surface electrode 11C, at least a part of the part 12 is embedded in the surface of the substrate 11, and the electrode 11C of the substrate 11 and the electrodes 12D, 12E of the part 12 are integrated by sintering them. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
