PROBE CARD FOR WAFER TEST, WAFER-TESTING DEVICE, AND WAFER-TESTING METHOD

摘要

A probe card for wafer test in which necessary electric connection and highly precise resistance measurement is infallibly achieved and low-cost production is possible even when a wafer has a large area and many small electrodes to be tested. A wafer-testing device and method using such probe cards are also disclosed. A probe card comprises a first electrode sheet, a first anisotropically conductive sheet provided on the first electrode sheet, a second anisotropically conductive sheet provided on the back of the first electrode sheet and having through-holes formed correspondingly to electrodes to be tested, and a second electrode sheet provided on the back of the second anisotropically conductive sheet. The first electrode sheet has a flexible insulating sheet with through-holes formed correspondingly to the electrodes to be tested, ring-shaped electrodes so formed on the insulating sheet as to surround the through-holes, and relay electrodes formed on the back of the insulating sheet. The second electrode sheet has core electrodes for test provided correspondingly to the electrodes to be tested and core electrodes for connection provided correspondingly to the relay electrodes.