发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To easily set protection voltage even when having a gate insulation film of low breakdown voltage. SOLUTION: The semiconductor device is provided with a MOS transistor 50, and an ESD protection element 2. The MOS transistor 50 is provided with a first gate insulation film 36 provided on the first element area of a semiconductor substrate 30 having first and second element areas of a first conductive type separated from each other, a first gate electrode 38 provided on the first gate insulation film, and first impurity areas 42 of a second conductive type provided in first element areas on both of the sides of the first gate electrode. The ESD protection element 2 is provided with a second gate insulation film 36 provided on the second element area and having substantially the same thickness as the first gate insulation film, a second gate electrode 38 provided on the second gate insulation film and connected with the first gate electrode, and a second impurity areas 42 of the second conductive type provided in second element areas on both of the sides of the second gate electrode. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007067347(A) 申请公布日期 2007.03.15
申请号 JP20050255124 申请日期 2005.09.02
申请人 TOSHIBA CORP 发明人 KINOSHITA ATSUHIRO
分类号 H01L27/06;H01L21/336;H01L21/822;H01L21/8234;H01L27/04;H01L27/08;H01L27/088;H01L29/786;H01L29/88 主分类号 H01L27/06
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