| 摘要 |
Disclosed is a silicone based condenser microphone comprising: a metal case which includes a sound hole, a board which is mounted with a MEMS microphone chip and an ASIC chip having an electric voltage pump and a buffer IC and is formed with a connecting pattern for joining with the metal case. A fixing material for fixing the metal case to the board, and an adhesive for applying to the whole part where the metal case fixed to the board by the fixing material is joined with the board to bond the metal case to the board. Therefore, the metal case is tack-welded to the board by a laser to fix the case to the board and then the case is bonded to the board with the adhesive, thereby decreasing an inferiority ratio and strengthening a joining force and thus enhancing a mechanical firmness and highly resisting noise from the outside.
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