SUBSTRATE BONDING DEVICE AND THE SUBSTRATE BONDING METHOD USING IT

摘要

A substrate bonding device and a method for bonding a substrate using the same are provided to bond the substrates with various sizes by pressing the lower substrate upwardly in case of bonding the upper and lower substrates with a large area, and by pressing the upper substrate in case of bonding the upper and lower substrates with a small area. A substrate bonding device includes an upper pressing unit(200), and a lower pressing unit(400). The upper pressing unit(200) has an upper plate and a pressing unit. The upper plate presses an upper substrate(100). The pressing unit provides a pressing force to the upper plate. A lower pressing unit(400) is located on a lower part of the upper pressing unit(200), and supports a lower substrate(140) which is bonded with the upper substrate(100). A lower plate(410) presses the lower substrate(140). An pressing unit of the lower pressing unit(400) provides a pressing force to the lower plate(410). The upper pressing unit(200) further has a vacuum absorption unit to support the upper substrate(100) on an upper part.