| 摘要 |
<p>A thermal activation apparatus includes a thermal head (2) for thermally activating a heat-sensitive adhesive layer of a heat-sensitive adhesive sheet by heating, and a platen roller (3) for thermal activation opposed to the thermal head for thermal activation. The thermal head for thermal activation is energized by a spring (4), whereby the platen roller for thermal activation is pressed to the thermal head for thermal activation with a pressure. The heat-sensitive adhesive sheet (10) is heated while being transported between the platen roller (3) for thermal activation and the thermal head (2) for thermal activation, whereby the heat-sensitive adhesive layer is thermally activated. To smoothly transport a heat-sensitive adhesive sheet without stagnating at a position opposed to a thermal head for thermal activation, even in the case where a non-activated portion is present in a heat-sensitive adhesive layer.</p> |
