An improved method to embed thick film components

摘要

The invention is directed to a method to embed a thick film resistor composition (103) into a printed wiring board (105,104) comprising the steps of applying a reinforcing composition onto a resistor composition (103) disposed on a metallic substrate (101) forming an assembly (101,102,103,110) wherein the resistor composition (103) is at least partially coated with the reinforcing composition; processing the assembly; and applying the assembly onto at least one side of an organic substrate forming a component wherein the organic substrate (104) is at least partially coated with an adhesive layer (105) and wherein the reinforcing composition side of the assembly is embedded into the adhesive layer. The reinforcing composition allows laser trimming of the fired resistor and also eliminates cracking during lamination steps of the invention.The invention is directed to a method to embed a thick film resistor composition (103) into a printed wiring board (105,104) comprising the steps of applying a reinforcing composition onto a resistor composition (103) disposed on a metallic substrate (101) forming an assembly (101,102,103,110) wherein the resistor composition (103) is at least partially coated with the reinforcing composition; processing the assembly; and applying the assembly onto at least one side of an organic substrate forming a component wherein the organic substrate (104) is at least partially coated with an adhesive layer (105) and wherein the reinforcing composition side of the assembly is embedded into the adhesive layer. The reinforcing composition allows laser trimming of the fired resistor and also eliminates cracking during lamination steps of the invention.