CHEMICAL MECHANICAL POLISHING APPARATUS

摘要

Chemical mechanical polishing equipment is provided to prevent contamination due to a polishing liquid and a polishing byproduct and degradation of a semiconductor by using a platen with a sloping surface whose outer side edge of the platen is lower than an inner side thereof. A platen(101) has a mounting surface where a polishing pad is mounted. A polishing supplying unit(301) supplies a polishing liquid to the polishing pad. A polishing head(401) supports a semiconductor wafer(W). The polishing head pressurizes and rotates the semiconductor wafer on the polishing pad. A container(701) is arranged to surround the polishing pad. An outer side edge of the platen is lower than an inner side thereof. An edge of the platen had a sloping surface. The edge of the platen has a rounded surface. The edge of the platen is a step type.