| 发明名称 |
PREPREG FOR PRINTED WIRING BOARD, METAL FOIL CLAD LAMINATE AND PRINTED WIRING BOARD, AND, METHOD FOR MANUFACTURING MULTI-LAYER PRINTED WIRING BOARD |
| 摘要 |
A prepreg for a printed wiring board, which is obtained by a method comprising impregnating a base material with a thermosetting resin composition, followed by drying, characterized in that no crack is caused in the base material even when it is bent by an angle of 90 degree. ® KIPO & WIPO 2007 |
| 申请公布号 |
KR20070027725(A) |
申请公布日期 |
2007.03.09 |
| 申请号 |
KR20077001494 |
申请日期 |
2005.06.22 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TAKANO NOZOMU;TAKEUCHI KAZUMASA;MASUDA KATSUYUKI;TANAKA MASASHI;OBATA KAZUHITO;OOYAMA YUUJI;MATSUURA YOSHITSUGU |
| 分类号 |
B29B11/16;B32B15/08;H05K1/03;H05K3/46 |
主分类号 |
B29B11/16 |
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