SUPPORTING PLATE, APPARATUS AND METHOD FOR STRIPPING SUPPORTING PLATE

摘要

A support plate, and apparatus and method for stripping the support plate are provided to reduce a support plate stripping time by supplying quickly a solvent onto the entire surface of an adhesive using an improved recess structure. A support plate(1) is used for being attached with a circuit forming surface of a substrate via an adhesive. The support plate includes a first through hole(2) at a center portion of the support plate, a groove, and a second through hole. The groove(3) is connected through the first through hole. The second through hole(4) is connected through the groove. The groove is formed like a lattice type structure, a zigzag type structure or a hive type structure. The first through hole is used for supplying a solvent. The second through hole is used for exhausting the solvent.