| 摘要 |
Semiconductor device manufacturing equipment is provided to prevent the attachment of particles, to reduce the contamination of a process chamber and to improve the yield of wafer by restraining an abrupt temperature change in the process chamber using a temperature retaining layer. Semiconductor device manufacturing equipment includes a process chamber and a temperature retaining layer. The process chamber(10) is used for performing a semiconductor device manufacturing process. The temperature retaining layer(100) is formed on an inner wall of the process chamber. The temperature retaining layer is used for preventing an inner temperature of the process chamber from being abruptly changed.
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