发明名称 PRESSURE SENSOR AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To resolve a problem of lowering of measurement accuracy caused by remaining of outgas generated from Au-Sn film in an air-tight space when eutectic bonding intervened by Au-Sn bonding film is performed for bonding two Au films individually formed on a stable substrate and a movable substrate. SOLUTION: An electrostatic capacity type pressure sensor is provided with through holes 25 and 26 formed by penetrating the stable substrate or the movable substrate and conducting each of the Au stable electrode films and the movable electrode film with an external circuit, and provided with an air-tight space S with a small gap between the movable electrode film and a dielectric film. The small gap is made an air-tight space by shielding the connection between the through hole and the small gap. Also, a sealing conduction member 30 is arranged by way of the through holes for individually conducting the through hole and the Au stable electrode film and/or the movable electrode film. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007057394(A) 申请公布日期 2007.03.08
申请号 JP20050243484 申请日期 2005.08.24
申请人 EPSON TOYOCOM CORP 发明人 KAMEDA TAKAHIRO;WATANABE JUN
分类号 G01L9/00;H01L29/84 主分类号 G01L9/00
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