| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To make thin a wiring board having a semiconductor chip and inhibit its warpage as to a method of manufacturing the wiring board. <P>SOLUTION: The method for manufacturing the wiring board with an insulating layer 116 in which a semiconductor chip 110 is embedded includes: a first step of forming on a support substrate 101 the insulating layer 116 on which a semiconductor chip 110 is embedded and interconnect lines 105a, 108 and 113 connected to the semiconductor chip 110; a second step of removing this support substrate 101 by etching; and a third step of forming reinforcing layers 103 and 114 at the same time so as to sandwich the insulating layer 106 after the second step is completed. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
