| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor memory card that can be manufactured at low cost. SOLUTION: The semiconductor memory card 100 comprises a wiring board 2, having input/output terminals 1 for inputting and outputting a predetermined signal formed on the top surface side thereof; a semiconductor memory 4 connected to a pad 3, formed on the undersurface side of the wiring board 2; plated wirings 6 for supplying required power to an electrolytic plating, cut at the side end 5 of the wiring board 2 formed on the wiring board 2; and a sealing resin 7 for sealing the semiconductor memory 4 on the wiring board 2, and for sealing the side end 5 of the wiring board 2 and at least an end 6a of one plated wiring 6. COPYRIGHT: (C)2007,JPO&INPIT
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