METHOD FOR FABRICATING SEMICONDUCTOR PACKAGES

摘要

A method for positioning a semiconductor component is disclosed. The method includes providing the semiconductor component and a carrier, the carrier having a plurality of openings, a protruded portion being provided at each corner position of each of the openings and extended toward a center of the opening, a distance between two diagonal protruded portions of the opening being slightly larger than that between two diagonal corners of the semiconductor component; and positioning the semiconductor component in the openings of the carrier via the protruded portions provided at each corner position of each of the openings.