| 摘要 |
PROBLEM TO BE SOLVED: To provide a marking device capable of accurately detecting a failure in marking and improving a throughput in marking. SOLUTION: The marking device for ejecting marking ink onto a defective semiconductor chip included in a semiconductor wafer 1 has: an inker 20 located above the wafer 1 for ejecting the ink; sensors 32 and 34 for detecting the ink ejected from the inker 20 in a space between the inker and the wafer; and a control part for determining whether the ink has been ejected from the inker 20 at appropriate time for ejection, using the detection results from the sensors 32 and 34. COPYRIGHT: (C)2007,JPO&INPIT
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