PRINTED WIRING BOARD AND METHOD FOR FABRICATING THE SAME

摘要

A printed wiring board and a method for fabricating the same are provided to prevent the damage of a pad or deformation of a loaded solder ball, by controlling the pad loaded with the solder ball not to be higher than an adjacent region. A printed wiring board(50) includes a wiring pattern(14) and a pad(20) loaded with a solder ball as a connection port. The wiring pattern includes a pad. The pad is constituted by stacking a conductive layer, a bottom plated layer and a top plated layer in sequence. An adjacent region(34) surrounding the pad is constituted by stacking at least the bottom plated layer and a solder register among the conductive layer, the bottom plated layer and the top plated layer. The height of a top plane of the pad does not exceed the height of a top plane of the adjacent region.