EMULSION TYPE RESIN COMPOSITION

摘要

An object of the present invention is to provide an emulsion type resin composition by the use of which film formation may be attained at a low temperature, and in addition, the coating film having excellent physical properties such as hardness, contamination resistance, water resistance, and weatherability can be formed. The emulsion type resin composition having the minimum film forming temperature of 0°C or lower, containing substantially no volatile organic compound, a Koenig hardness of a film obtained by drying the emulsion type resin composition at 23°C for 24 hours is five cycles or more, and the water absorption rate thereof is 20% by mass or less.