| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing method and a polishing apparatus capable of executing a multi-stage polishing process wherein the throughput is enhanced by particularly omitting the measurement of the surface state of substrates between polishing processes as much as possible to the utmost extent and the polishing condition (polishing recipe) is improved. <P>SOLUTION: The polishing method sequentially repeats operations of: extracting a workpiece to be polished (substrate) from a cassette for accommodating a plurality of the workpieces to be polished; applying polishing to the extracted workpiece over a plurality of stages ;and then returning the polished workpiece to the cassette, and applies either of a first polishing process, wherein polishing over a plurality of stages under a preset polishing condition and the measurement of the surface of the workpiece to be polished before and after the polishing of each stage are respectively executed, and a second polishing process, wherein polishing in each prescribed stage under the polishing condition corrected on the basis of a result of the measurement is executed, to the workpiece to be polished extracted from the cassette. <P>COPYRIGHT: (C)2007,JPO&INPIT |
