| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board in which thermoplastic resin and thermosetting resin, which are used as interlayer insulating resin, are not peeled from a conductive projection, without depending on a temporary adhesion condition at the time of manufacturing the circuit board by connection using the conductive projection. SOLUTION: For manufacturing the circuit board where a circuit substrate having metal foil in which the conductive projection is erected at least on one face, and an insulating resin layer stuck to one face of metal foil by pressure in a state where the conductive projection passes through the insulating resin layer is laminated with another circuit substrate or with a metal foil; the insulating resin layer is stuck by pressure to metal foil where the conductive projection is erected. The top of the conductive projection is pressurized, and the size of the top of the conductive projection is made larger than the hole through which the conductive projection passes in the insulating resin layer. The circuit substrate is laminated with the other circuit member or metal foil. Circuit layers are connected by the conductive projection. COPYRIGHT: (C)2007,JPO&INPIT |
