发明名称 LIFT FINGER OF WAFER LIFT UNIT
摘要 A lift finger of a wafer lift unit is provided to prevent damage of a wafer and process defect by realigning a loaded wafer having a distorted alignment and placing it on a wafer supporter. A wafer realignment unit(112) is formed on an upper portion of the body and realigns a loaded wafer(W) having a distorted alignment. A wafer placing unit(120) is horizontally projected from a front end of the body. A connecting unit(130) is horizontally projected from a rear end of the body. The connecting unit has a screw coupling hole to be connected to a lift. The wafer realignment unit is a sloping unit. The sloping unit is formed to slide an edge of the connected wafer and make the edge unit of the wafer be placed on the wafer placing unit.
申请公布号 KR20070025092(A) 申请公布日期 2007.03.08
申请号 KR20050080858 申请日期 2005.08.31
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YUN, YOUNG MUN
分类号 H01L21/68 主分类号 H01L21/68
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