发明名称 |
LIFT FINGER OF WAFER LIFT UNIT |
摘要 |
A lift finger of a wafer lift unit is provided to prevent damage of a wafer and process defect by realigning a loaded wafer having a distorted alignment and placing it on a wafer supporter. A wafer realignment unit(112) is formed on an upper portion of the body and realigns a loaded wafer(W) having a distorted alignment. A wafer placing unit(120) is horizontally projected from a front end of the body. A connecting unit(130) is horizontally projected from a rear end of the body. The connecting unit has a screw coupling hole to be connected to a lift. The wafer realignment unit is a sloping unit. The sloping unit is formed to slide an edge of the connected wafer and make the edge unit of the wafer be placed on the wafer placing unit.
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申请公布号 |
KR20070025092(A) |
申请公布日期 |
2007.03.08 |
申请号 |
KR20050080858 |
申请日期 |
2005.08.31 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
YUN, YOUNG MUN |
分类号 |
H01L21/68 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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