| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of saving a space by reducing an installation space of a power supply line shared among a plurality of functional macros. SOLUTION: In an LSI chip 100 including a multilayered wire and a moisture-resistant ring 101, a VSS power supply terminal in the plurality of functional macros (IO macro 103, and a group of IO macros 107) is electrically connected with the moisture-resistant ring 101, thereby allowing the ring 101 to serve as the power supply line for connecting the VSS power supply terminal in the plurality of functional macros. Thus, a space for locating the VSS power supply line inside the ring 101 can be reduced, saving the space for the LSI chip 100. COPYRIGHT: (C)2007,JPO&INPIT |
